An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability. The optical auxiliary unit includes a housing frame and a movable lens assembly. The housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame.