An information processing apparatus according to one aspect of the present invention includes a wide IO memory device stacked on an SoC die that includes a CPU, acquires temperature information of multiple memories in the wide IO memory device, loads applications for executing separate functions to multiple memories, excluding the memory positioned above the circuit on the SoC die related to the function to be executed by the application, and, when the execution of the loaded application is instructed, executes the application loaded to the memory having a lower temperature that was acquired.