Invention Grant
- Patent Title: Communication connecting device and lead frame assembly thereof
- Patent Title (中): 通信连接装置及其引线框组件
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Application No.: US14083562Application Date: 2013-11-19
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Publication No.: US09077117B2Publication Date: 2015-07-07
- Inventor: Chung-Nan Pao , Xiaoyin Wang , Yu-Hsiung Lin
- Applicant: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Applicant Address: CN Suzhou, Jiangsu Province
- Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Suzhou, Jiangsu Province
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201310425991 20130917
- Main IPC: H01R13/514
- IPC: H01R13/514 ; H01R13/648

Abstract:
A lead frame assembly includes two lead frames detachably coupled to each other. Each lead frame has an insulating frame, several signal terminals fixed on the insulating frame, and a ground terminal fixed on the insulating frame. One of the ground terminals has a shielding sheet and several groups of elastic arms, and the shielding sheet and the elastic arms are protruding from the corresponding insulating frame; another ground terminal has several shielding portions protruding from the corresponding insulating frame. The ground terminals are contact with each other along a shielding direction, and the groups of elastic arms are respectively abutted against the shielding portions. In a space, which is surroundingly defined by the contour of the shielding sheet extending along the shielding direction, the shielding direction passes through at least one of the shielding sheet, the elastic arms, and the shielding portions.
Public/Granted literature
- US20150079842A1 COMMUNICATION CONNECTING DEVICE AND LEAD FRAME ASSEMBLY THEREOF Public/Granted day:2015-03-19
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