Invention Grant
- Patent Title: Sealing material for thin plate member
- Patent Title (中): 薄板构件密封材料
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Application No.: US13982875Application Date: 2012-03-30
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Publication No.: US09077010B2Publication Date: 2015-07-07
- Inventor: Akira Ueda , Kenichi Takahashi , Atsushi Fujii , Tetsuya Kawamura
- Applicant: Akira Ueda , Kenichi Takahashi , Atsushi Fujii , Tetsuya Kawamura
- Applicant Address: JP Tokyo
- Assignee: Nippon Valqua Industries, Ltd.
- Current Assignee: Nippon Valqua Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2011-078007 20110331; JP2012-057048 20120314
- International Application: PCT/JP2012/058522 WO 20120330
- International Announcement: WO2012/133738 WO 20121004
- Main IPC: F16L17/00
- IPC: F16L17/00 ; H01M2/08 ; F16J15/06 ; F16J15/10 ; H01M8/18 ; H01M8/02

Abstract:
There is provided a sealing material for a thin plate member which eliminates the need to form seal grooves as in prior art when applied to a thin plate member such as a cell of a secondary battery such as a redox flow battery, a fuel cell and a lead storage battery, and which provides satisfactory sealing and can compactify and reduce in weight a device to be used and facilitate assembling with reduced cost as well as allowing more cells to be stacked resulting in improving fuel capacity. The annular sealing material for a thin plate member that provides sealing between thin plate members includes a lateral sealing body disposed on a lateral of the thin plate member, and a pair of sealing legs branching from the lateral sealing body in a fork shape and disposed on the front surface and the back surface of the thin plate member.
Public/Granted literature
- US20130307227A1 Sealing Material for Thin Plate Member Public/Granted day:2013-11-21
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