Invention Grant
- Patent Title: Method of fabricating nonpolar gallium nitride-based semiconductor layer, nonpolar semiconductor device, and method of fabricating the same
- Patent Title (中): 制造非极性氮化镓系半导体层的方法,非极性半导体装置及其制造方法
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Application No.: US13848352Application Date: 2013-03-21
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Publication No.: US09076896B2Publication Date: 2015-07-07
- Inventor: Seung Kyu Choi , Chae Hon Kim , Jung Whan Jung
- Applicant: Seoul Viosys Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2012-0028589 20120321; KR10-2012-0029906 20120323
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/3205 ; H01L21/4763 ; H01L29/15 ; H01L31/0256 ; H01L33/00 ; H01L33/32 ; H01L33/12 ; H01L33/16

Abstract:
A method of fabricating a nonpolar gallium nitride-based semiconductor layer is provided. The method is a method of fabricating a nonpolar gallium nitride layer using metal organic chemical vapor deposition, and includes disposing a gallium nitride substrate with an m-plane growth surface within a chamber, raising a substrate temperature to a GaN growth temperature by heating the substrate, and growing a gallium nitride layer on the gallium nitride substrate by supplying a Ga source gas, an N source gas, and an ambient gas into the chamber at the growth temperature. The supplied ambient gas contains N2 and does not contain H2.
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