Invention Grant
- Patent Title: Method of producing semiconductor module and semiconductor module
- Patent Title (中): 半导体模块和半导体模块的制造方法
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Application No.: US13470029Application Date: 2012-05-11
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Publication No.: US09076892B2Publication Date: 2015-07-07
- Inventor: Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
- Applicant: Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
- Applicant Address: JP Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-108159 20110513; JP2012-029803 20120214
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/552 ; H01L25/065
Abstract:
In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
Public/Granted literature
- US20120286415A1 METHOD OF PRODUCING SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE Public/Granted day:2012-11-15
Information query
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