Invention Grant
- Patent Title: Laser machining method
- Patent Title (中): 激光加工方法
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Application No.: US13265027Application Date: 2010-03-19
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Publication No.: US09076855B2Publication Date: 2015-07-07
- Inventor: Ryuji Sugiura
- Applicant: Ryuji Sugiura
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2009-101924 20090420
- International Application: PCT/JP2010/054841 WO 20100319
- International Announcement: WO2010/122866 WO 20101028
- Main IPC: B23K26/38
- IPC: B23K26/38 ; H01L21/78 ; B23K26/00 ; B23K26/40 ; B28D1/22 ; B28D5/00

Abstract:
An object to be processed 1 is irradiated with laser light L along a line to cut 5a while locating a converging point within the object 1, so as to form a modified region 7a. Thereafter, the irradiation with the laser light L is performed again along the line 5a, so as to form a modified region 7b between a front face 3 and the first modified region 7a in the object 1 and generate a fracture Cb extending from the modified region 7b to the front face 3. Therefore, a deflecting force F1 occurring when forming the modified region 7a in the object 1 can be released and canceled out by the fracture Cb. As a result, the object 1 can be inhibited from deflecting.
Public/Granted literature
- US20120091107A1 LASER MACHINING METHOD Public/Granted day:2012-04-19
Information query
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