Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14233410Application Date: 2011-08-30
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Publication No.: US09076836B2Publication Date: 2015-07-07
- Inventor: Kazufumi Ishii
- Applicant: Kazufumi Ishii
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- International Application: PCT/JP2011/069630 WO 20110830
- International Announcement: WO2013/030956 WO 20130307
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H02M7/00 ; H02M7/487

Abstract:
The present invention implements an equivalent circuit to a semiconductor device for an upper arm by electrically connecting a terminal for E1C2 and a terminal for K with the use of an external wiring in a semiconductor device. On the other hand, in a semiconductor device including a circuit having the same structure as the semiconductor device, an external wiring is used to electrically connect a terminal for A and a terminal for E1C2. Consequently, there is implemented an equivalent circuit to a semiconductor device for a lower arm which is of a different type from the semiconductor device for the upper arm.
Public/Granted literature
- US20140145241A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-05-29
Information query
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