Invention Grant
- Patent Title: Edge ring for a thermal processing chamber
- Patent Title (中): 用于热处理室的边缘环
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Application No.: US14264828Application Date: 2014-04-29
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Publication No.: US09076828B2Publication Date: 2015-07-07
- Inventor: Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/673
- IPC: H01L21/673 ; F27D11/12 ; H01L21/687 ; F27D5/00 ; H01L21/67
Abstract:
Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.
Public/Granted literature
- US20140233929A1 EDGE RING FOR A THERMAL PROCESSING CHAMBER Public/Granted day:2014-08-21
Information query
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