Invention Grant
- Patent Title: Power module and lead frame for power module
- Patent Title (中): 电源模块和电源模块引线框架
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Application No.: US13994417Application Date: 2011-12-13
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Publication No.: US09076780B2Publication Date: 2015-07-07
- Inventor: Yoshinori Negishi , Hiroshi Nakano , Eiichi Ide , Haruo Akahoshi , Motoko Harada , Toshiaki Ishii
- Applicant: Yoshinori Negishi , Hiroshi Nakano , Eiichi Ide , Haruo Akahoshi , Motoko Harada , Toshiaki Ishii
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2010-283092 20101220
- International Application: PCT/JP2011/078770 WO 20111213
- International Announcement: WO2012/086464 WO 20120628
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H01L23/495 ; H01L23/00 ; H01L23/373 ; H01L21/48 ; H01L21/56 ; H01L23/36 ; H01L23/433 ; H01L23/31
Abstract:
The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.
Public/Granted literature
- US20130270684A1 POWER MODULE AND LEAD FRAME FOR POWER MODULE Public/Granted day:2013-10-17
Information query
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