Invention Grant
- Patent Title: Fixing device and thermal module incorporating the same
- Patent Title (中): 固定装置和包含其的热模块
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Application No.: US13467059Application Date: 2012-05-09
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Publication No.: US09076769B2Publication Date: 2015-07-07
- Inventor: Chin-Hsien Chen
- Applicant: Chin-Hsien Chen
- Applicant Address: TW New Taipei
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H05K7/00 ; H01L23/467 ; H01L23/40 ; H01L23/427 ; F28D15/02 ; G06F1/20 ; H01L23/367
Abstract:
An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.
Public/Granted literature
- US20130135825A1 FIXING DEVICE AND THERMAL MODULE INCORPORATING THE SAME Public/Granted day:2013-05-30
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