An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.