Invention Grant
- Patent Title: Integrated circuit system with debonding adhesive and method of manufacture thereof
- Patent Title (中): 具有脱粘胶的集成电路系统及其制造方法
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Application No.: US14038275Application Date: 2013-09-26
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Publication No.: US09076724B1Publication Date: 2015-07-07
- Inventor: Won Kyoung Choi , Pandi Chelvam Marimuthu
- Applicant: Won Kyoung Choi , Pandi Chelvam Marimuthu
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
Abstract:
A system and method of manufacture of an integrated circuit system includes: a die having a via, the die having a top side and a bottom side; a top interconnect mounted to the via at the top side; an interconnect pillar mounted to the via at the bottom side; a device interconnect mounted to the interconnect pillar; and a base adhesive covering the interconnect pillar and the device interconnect.
Information query
IPC分类:
