Invention Grant
- Patent Title: Substrate for mounting light-emitting element and light-emitting device
- Patent Title (中): 用于安装发光元件和发光装置的基板
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Application No.: US13581695Application Date: 2011-02-23
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Publication No.: US09076714B2Publication Date: 2015-07-07
- Inventor: Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
- Applicant: Seiichi Nakatani , Tatsuo Ogawa , Kazuo Kimura , Shigetoshi Segawa
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-043773 20100301
- International Application: PCT/JP2011/001017 WO 20110223
- International Announcement: WO2011/108227 WO 20110909
- Main IPC: H01L29/86
- IPC: H01L29/86 ; H01L25/16 ; H01L33/48 ; H01L33/54 ; H01L33/64
Abstract:
There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.
Public/Granted literature
- US20120319159A1 SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE SAME AND LIGHT-EMITTING DEVICE Public/Granted day:2012-12-20
Information query
IPC分类:
