Invention Grant
- Patent Title: Electronic component and method for manufacturing the same
- Patent Title (中): 电子元件及其制造方法
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Application No.: US13800135Application Date: 2013-03-13
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Publication No.: US09076585B2Publication Date: 2015-07-07
- Inventor: Ju Hwan Yang , Sang Moon Lee , Young Seuck Yoo , Sung Kwon Wi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0035514 20120405
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/10 ; H01F17/00

Abstract:
The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself.
Public/Granted literature
- US20130265131A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-10-10
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