Invention Grant
- Patent Title: Chip thermistor and thermistor assembly board
- Patent Title (中): 片式热敏电阻和热敏电阻组合板
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Application No.: US13884390Application Date: 2011-10-18
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Publication No.: US09076576B2Publication Date: 2015-07-07
- Inventor: Yo Saito , Kouki Yamada , Yukihiro Murakami
- Applicant: Yo Saito , Kouki Yamada , Yukihiro Murakami
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-260187 20101122
- International Application: PCT/JP2011/073962 WO 20111018
- International Announcement: WO2012/070336 WO 20120531
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H01C7/00 ; H01C7/02 ; H01C7/04

Abstract:
A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.
Public/Granted literature
- US20130222106A1 CHIP THERMISTOR AND THERMISTOR ASSEMBLY BOARD Public/Granted day:2013-08-29
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