The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate.