Invention Grant
- Patent Title: Electronic balance with windproof case and electrically conductive structure
- Patent Title (中): 电子天平采用防风外壳和导电结构
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Application No.: US13692264Application Date: 2012-12-03
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Publication No.: US09074926B2Publication Date: 2015-07-07
- Inventor: Atsushi Iizuka
- Applicant: SHIMADZU CORPORATION
- Applicant Address: JP Kyoto
- Assignee: SHIMADZU CORPORATION
- Current Assignee: SHIMADZU CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Sughrue Mion, PLLC
- Main IPC: G01G21/28
- IPC: G01G21/28

Abstract:
Brackets and are disposed on the back surface of an upper case on which a pair of molded members and constituting a cylindrical structure forming a rear wall of a windproof case are erected. At one end of each of the brackets, the bracket is electrically connected to the molded member and the bracket is electrically connected to the molded member by screws of the upper case, and the brackets are electrically connected to a lower case by screws. Further, a metal plate on the upper case is electrically connected via a metal member fixed to the cylindrical structure.
Public/Granted literature
- US20140151134A1 ELECTRONIC BALANCE Public/Granted day:2014-06-05
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