Invention Grant
- Patent Title: Thermoplastic resin composition and molded product including same
- Patent Title (中): 热塑性树脂组合物和包含其的成型体
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Application No.: US14143067Application Date: 2013-12-30
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Publication No.: US09074094B2Publication Date: 2015-07-07
- Inventor: Doo-Young Kim , Jung-Hun Lee , Jin-Kyung Cho , Do-Hoon Chang , Chang-Min Hong
- Applicant: Cheil Industries Inc.
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2012-0158706 20121231
- Main IPC: C08F290/06
- IPC: C08F290/06 ; C08K3/28 ; C08F283/00 ; C08F12/28 ; C08F16/12 ; C08L71/12 ; C08L77/02 ; C08L77/06 ; C08K5/092 ; C08K5/1539

Abstract:
A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.
Public/Granted literature
- US20140187686A1 Thermoplastic Resin Composition and Molded Product Including Same Public/Granted day:2014-07-03
Information query
IPC分类: