Invention Grant
- Patent Title: Reversible fan module for electronic circuit assemblies
- Patent Title (中): 用于电子电路组件的可逆风扇模块
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Application No.: US13756094Application Date: 2013-01-31
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Publication No.: US09055693B2Publication Date: 2015-06-09
- Inventor: Luis Arreola
- Applicant: Virtual Instruments Corporation
- Applicant Address: US CA San Jose
- Assignee: Virtual Instruments Corporation
- Current Assignee: Virtual Instruments Corporation
- Current Assignee Address: US CA San Jose
- Agency: Fenwick & West LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic enclosure includes a chassis with a fan base and a fan module. The fan base and fan module are disposed so that the fan module may installed in the fan base in a first configuration to provide front-to-rear air flow within the enclosure, or the fan module may be detached from the fan base, turned and reinserted into the fan base in a second configuration to provide rear-to-front air flow within the enclosure. The fan base is provided with two power connectors, one of which mates with the fan module in the first configuration and the second one of which mates with the fan module in the second configuration.
Public/Granted literature
- US20140211418A1 REVERSIBLE FAN MODULE FOR ELECTRONIC CIRCUIT ASSEMBLIES Public/Granted day:2014-07-31
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