An electronic component including a terminal holding unit which holds a plurality of terminals, a metallic shell which houses the terminal holding unit inside thereof, the metallic shell including an insulation opening where a connection object which connects with the terminals is inserted and contact terminals which are adjacent to the metallic shell, each of the contact terminals including a contact plane which faces an insertion direction of the connection object into the metallic shell. A plate-like leg for fixating the metallic shell to a substrate is formed at each of side surfaces of the metallic shell.