Invention Grant
- Patent Title: Electronic device and method of manufacturing the same
- Patent Title (中): 电子设备及其制造方法
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Application No.: US14029869Application Date: 2013-09-18
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Publication No.: US09054311B2Publication Date: 2015-06-09
- Inventor: Hajime Kubota , Masayuki Itoh , Masakazu Kishi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2012-287542 20121228
- Main IPC: H04R23/00
- IPC: H04R23/00 ; H01L41/313 ; H03H9/05 ; H03H9/10 ; H03H3/02

Abstract:
An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface.
Public/Granted literature
- US20140183672A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-07-03
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