Invention Grant
- Patent Title: Substrate for mounting light-emitting element, production process thereof and light-emitting device
- Patent Title (中): 用于安装发光元件的基板,其制造方法和发光装置
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Application No.: US13190156Application Date: 2011-07-25
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Publication No.: US09054287B2Publication Date: 2015-06-09
- Inventor: Seigo Ohta
- Applicant: Seigo Ohta
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-166968 20100726; JP2011-128603 20110608; JP2011-156025 20110714
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L33/48 ; H01L33/64

Abstract:
To provide a substrate for mounting a light-emitting device, which is provided with a silver reflection layer having a high reflectance and being less susceptible to deterioration of the reflectance due to corrosion and which has an improved light extraction efficiency.A substrate for mounting a light-emitting element 1, which comprises a substrate main body 2, a silver reflection layer 6 composed mainly of silver or a silver alloy, formed on the substrate main body 2, and a protective layer formed so as to cover the entire surface of the silver reflection layer 6, wherein the protective layer 7 contains an alumina filler and further contains a glass constituting the protective layer 7, having silver ions diffused therein. The concentration of silver ions contained in the glass of the protective layer 7 is at least 0.5 mass % and at most 5.0 mass %.
Public/Granted literature
- US20120018759A1 SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, PRODUCTION PROCESS THEREOF AND LIGHT-EMITTING DEVICE Public/Granted day:2012-01-26
Information query
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