Invention Grant
- Patent Title: Array substrate, method for fabricating the same, and display device
- Patent Title (中): 阵列基板及其制造方法以及显示装置
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Application No.: US14079134Application Date: 2013-11-13
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Publication No.: US09054195B2Publication Date: 2015-06-09
- Inventor: Xiang Liu , Gang Wang
- Applicant: Boe Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210458462 20121114
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/00 ; H01L29/786 ; H01L29/66

Abstract:
Embodiments of the present application provide an array substrate and a method for fabricating the same. The array substrate comprises: a base substrate, a plurality of thin film transistors formed on the base substrate; the array substrate also comprising: a buffer layer formed on the substrate between the substrate and the film transistors; wherein, the buffer layer is a metal oxide film layer. Embodiments of the present application also provide a display device having such array substrate.
Public/Granted literature
- US20140131715A1 ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND DISPLAY DEVICE Public/Granted day:2014-05-15
Information query
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