Invention Grant
- Patent Title: Semiconductor device, integrated circuit and method of manufacturing a semiconductor device
- Patent Title (中): 半导体器件,集成电路及制造半导体器件的方法
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Application No.: US13828894Application Date: 2013-03-14
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Publication No.: US09054181B2Publication Date: 2015-06-09
- Inventor: Andreas Meiser , Till Schloesser
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L27/12 ; H01L31/0392 ; H01L29/78 ; H01L29/10 ; H01L29/66

Abstract:
A semiconductor device includes a transistor. The transistor includes a source region, a drain region, a body region, a drift zone, and a gate electrode being adjacent to the body region. The body region, the drift zone, the source region and the drain region are disposed in a first semiconductor layer having a first main surface. The body region and the drift zone are disposed along a first direction between the source region and the drain region, the first direction being parallel to the first main surface. The transistor further includes a drift control region arranged adjacent to the drift zone, the drift control region being disposed over the first main surface.
Public/Granted literature
- US20140264580A1 Semiconductor Device, Integrated Circuit and Method of Manufacturing a Semiconductor Device Public/Granted day:2014-09-18
Information query
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