Invention Grant
US09054162B2 Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
有权
用于在基板中形成导电通孔的方法和装置，基于自动机器人的制造系统，包括具有通孔的基板的部件和插入件装置
- Patent Title: Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
- Patent Title (中): 用于在基板中形成导电通孔的方法和装置，基于自动机器人的制造系统，包括具有通孔的基板的部件和插入件装置
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Application No.: US13988796Application Date: 2011-11-21
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Publication No.: US09054162B2Publication Date: 2015-06-09
- Inventor: Andreas Fischer , Göran Stemme , Frank Niklaus
- Applicant: Andreas Fischer , Göran Stemme , Frank Niklaus
- Agency: Harness, Dickey & Pierce
- Priority: SE1001125 20101122
- International Application: PCT/SE2011/051396 WO 20111121
- International Announcement: WO2012/071002 WO 20120531
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/48 ; H01L23/48 ; H01L23/14 ; H01L23/498
Abstract:
A method is disclosed for forming conductive vias in a substrate by filling preformed via holes, preferably through via holes, with conductive material. The method includes providing a plurality of preformed objects at least partly including ferromagnetic material on a surface of the substrate; providing a magnetic source on an opposite side of the substrate with respect to the plurality of preformed objects, thereby at least partly aligning at least a portion of the preformed objects with a magnetic field associated with the magnetic source; and moving the magnetic source relative the substrate, or vice versa, thereby moving the at least portion of the preformed objects into at least a portion of the via holes.
Public/Granted literature
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