Invention Grant
- Patent Title: Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices
- Patent Title (中): 基板固定器系统，基板支架，紧固机构，基板接合装置及其制造方法
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Application No.: US13354570Application Date: 2012-01-20
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Publication No.: US09054140B2Publication Date: 2015-06-09
- Inventor: Isao Sugaya , Junichi Chonan , Hidehiro Maeda
- Applicant: Isao Sugaya , Junichi Chonan , Hidehiro Maeda
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2009-170513 20090721; JP2009-253438 20091104
- Main IPC: B29C65/78
- IPC: B29C65/78 ; H01L21/67 ; H01L21/18 ; H01L21/683
Abstract:
Provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; an engagement receiving member that is provided on the second substrate holder and engages with the engaging member; and a dust restricting means for restricting generation of dust caused by the engagement of the engaging member and the engagement receiving member.
Public/Granted literature
Information query
