Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US14143542Application Date: 2013-12-30
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Publication No.: US09054137B2Publication Date: 2015-06-09
- Inventor: Toshinari Sasaki , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-156422 20090630
- Main IPC: H01L21/16
- IPC: H01L21/16 ; H01L29/66 ; H01L29/786 ; H01L21/02 ; H01L27/12

Abstract:
An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.
Public/Granted literature
- US20140113406A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-04-24
Information query
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