In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.