Staggered bond ads and I/O cells are arranged on an integrated circuit. The integrated circuit includes at least a first I/O cell having a first bond pad and first opposing set of recesses, a second I/O cell having a second bond sad and second opposing set of recesses, and a third I/O cell having a third bond sad and third opposing set of recesses. Each set of opposing recesses can be arranged in a staggered formation to receive adjacent bond pads, which can also be configured in a staggered formation.