Invention Grant
- Patent Title: Wafer and film coating method of using the same
- Patent Title (中): 晶圆和薄膜涂覆方法使用相同
-
Application No.: US14198783Application Date: 2014-03-06
-
Publication No.: US09053928B2Publication Date: 2015-06-09
- Inventor: Eric Lahaug , Chia-Ming Yang , Regan Stanley Tsui
- Applicant: Inotera Memories, Inc.
- Applicant Address: TW Taoyuan County
- Assignee: Inotera Memories, Inc.
- Current Assignee: Inotera Memories, Inc.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW102108898A 20130313
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L29/00 ; H01L29/06 ; H01L21/02
Abstract:
The present disclosure provides a wafer that can be used in coating films. The wafer includes a front surface, a back surface opposite to the front surface, and a plurality of trenches. The back surface further includes a central region and a surrounding region. The trenches are disposed on the back surface. The spacing between any two adjacent trenches in surrounding region is less than the spacing between any two adjacent trenches in the central region.
Public/Granted literature
- US20140264774A1 WAFER AND FILM COATING METHOD OF USING THE SAME Public/Granted day:2014-09-18
Information query
IPC分类:
