Invention Grant
- Patent Title: Wireless IC tag and method for manufacturing wireless IC tag
- Patent Title (中): 无线IC标签和制造无线IC标签的方法
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Application No.: US12525042Application Date: 2008-05-12
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Publication No.: US09053402B2Publication Date: 2015-06-09
- Inventor: Kenichi Honda
- Applicant: Kenichi Honda
- Applicant Address: JP Toyama
- Assignee: TATEYAMA KAGAKU INDUSTRY CO., LTD.
- Current Assignee: TATEYAMA KAGAKU INDUSTRY CO., LTD.
- Current Assignee Address: JP Toyama
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-127986 20070514; JP2007-151880 20070607
- International Application: PCT/JP2008/058697 WO 20080512
- International Announcement: WO2008/143043 WO 20081127
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01Q1/22 ; H01Q7/00 ; H05K3/22 ; H05K1/16 ; H05K3/34
Abstract:
A wireless IC tag which has an electrically insulative substrate, an antenna circuit provided on the surface of the substrate and an IC chip connected to the antenna circuit, wherein the antenna circuit is formed of solder and the IC chip is connected to the antenna circuit via the solder, andA wireless IC tag comprising an electrically insulative substrate, an antenna circuit provided on the surface of the substrate, an IC chip connected to the antenna circuit, and a jumper wire connected to the antenna circuit, wherein the antenna circuit is formed of a solder, the jumper wire is insulatively coated with a resin composition that evaporates, decomposes, or melts at a temperature not higher than a soldering temperature, and the jumper wire is located on the same side of the substrate where the antenna circuit is provided.
Public/Granted literature
- US20110006119A1 WIRELESS IC TAG AND METHOD FOR MANUFACTURING WIRELESS IC TAG Public/Granted day:2011-01-13
Information query
