A memory device package encloses two separate die, one being a standard nonvolatile memory integrated circuit (“IC”) die, and the other being any suitable authentication IC die. Either die may be stacked upon the other, or the die may be placed side-by-side. The external contacts may correspond to the power and signal requirements of the standard nonvolatile memory IC die so that the pin-out of the memory device package may present a standard pinout. The power and signal requirements of the authentication IC die may be satisfied with some or all of the pins for the nonvolatile memory integrated circuit die, or with other unused pins of the device package. One or more additional external contacts may be added exclusively for the authentication integrated circuit die. One or more signals may be dedicated as between the standard nonvolatile memory IC die and the authentication IC die.