Invention Grant
- Patent Title: Method of determining reinforcement position of circuit substrate and substrate assembly
- Patent Title (中): 确定电路基板和基板组件的加固位置的方法
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Application No.: US13648335Application Date: 2012-10-10
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Publication No.: US09053262B2Publication Date: 2015-06-09
- Inventor: Hiroshi Kobayashi , Satoshi Emoto , Toru Okada , Masayuki Kitajima , Takumi Masuyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2011-255535 20111122
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L23/00 ; H05K3/00 ; H05K1/02

Abstract:
A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.
Public/Granted literature
- US20130128477A1 METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE AND SUBSTRATE ASSEMBLY Public/Granted day:2013-05-23
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