Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.