Invention Grant
- Patent Title: Internal frame optimized for stiffness and heat transfer
- Patent Title (中): 内部框架优化了刚度和传热
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Application No.: US13756349Application Date: 2013-01-31
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Publication No.: US09049801B2Publication Date: 2015-06-02
- Inventor: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/16 ; G06F1/20 ; H04M1/02 ; H04M1/18

Abstract:
A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.
Public/Granted literature
- US20130141870A1 INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER Public/Granted day:2013-06-06
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