Invention Grant
- Patent Title: Multilayered ceramic electronic component and board for mounting the same
- Patent Title (中): 多层陶瓷电子元器件及其安装板
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Application No.: US13950657Application Date: 2013-07-25
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Publication No.: US09049798B2Publication Date: 2015-06-02
- Inventor: Eung Soo Kim , Dae Bok Oh , Sang Huk Kim , Jae Yeol Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0046834 20130426
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01G4/30 ; H01G2/06 ; H01G4/38

Abstract:
There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces.
Public/Granted literature
- US20140318841A1 MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME Public/Granted day:2014-10-30
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