Invention Grant
- Patent Title: Electrically bonded arrays of transfer printed active components
- Patent Title (中): 转印印刷活性组件的电子结合阵列
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Application No.: US13638040Application Date: 2011-03-22
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Publication No.: US09049797B2Publication Date: 2015-06-02
- Inventor: Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
- Applicant: Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
- Applicant Address: US NC Durham
- Assignee: Semprius, Inc.
- Current Assignee: Semprius, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, PA
- International Application: PCT/US2011/029365 WO 20110322
- International Announcement: WO2011/126726 WO 20111013
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/16 ; B23K31/00 ; H05K1/18 ; H01L21/683 ; H01L21/768 ; H01L23/48 ; H01L27/12 ; H01L27/146 ; H01L31/0203 ; H01L31/048 ; H05K13/04 ; H01L23/00 ; H01S5/022
Abstract:
An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
Public/Granted literature
- US20130153277A1 ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS Public/Granted day:2013-06-20
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