Invention Grant
- Patent Title: Data routing via lower layers in a communication system
- Patent Title (中): 通过通信系统中较低层的数据路由
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Application No.: US11764135Application Date: 2007-06-15
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Publication No.: US09049096B2Publication Date: 2015-06-02
- Inventor: Uppinder S. Babbar , Ajith T. Payyappilly , Srinivas R. Mudireddy , Venkata Satish Kumar Vangala
- Applicant: Uppinder S. Babbar , Ajith T. Payyappilly , Srinivas R. Mudireddy , Venkata Satish Kumar Vangala
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michael J. DeHaemer, Jr.
- Main IPC: H04J3/16
- IPC: H04J3/16 ; H04J3/22 ; H04L12/701 ; H04L12/707 ; H04L12/725 ; H04L12/801 ; H04W28/24 ; H04L29/06 ; H04W40/12

Abstract:
Techniques for routing data via lower layer paths through lower layers of a protocol stack are described. A lower layer path may be composed of a flow for packets, a link at a link layer, and a channel at a physical layer. A packet may be received from an application. A most preferred lower layer path for the packet may be selected from among at least one available lower layer path. The available lower layer path(s) may be arranged in an order of preference based on treatment of packets (e.g., best effort or QoS), protocols used at the link layer, channel types at the physical layer, and/or other factors. The packet may be sent via the selected lower layer path. A highest precedence lower layer path for the packet may be set up (e.g., in parallel) if this path is not among the at least one available lower layer path.
Public/Granted literature
- US20080101356A1 DATA ROUTING VIA LOWER LAYERS IN A COMMUNICATION SYSTEM Public/Granted day:2008-05-01
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