Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13480633Application Date: 2012-05-25
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Publication No.: US09048721B2Publication Date: 2015-06-02
- Inventor: Hidefumi Abe , Seiichiro Abe , Toru Shiba , Takuya Yagi , Toshiro Mayumi
- Applicant: Hidefumi Abe , Seiichiro Abe , Toru Shiba , Takuya Yagi , Toshiro Mayumi
- Applicant Address: JP Tokyo
- Assignee: KEIHIN CORPORATION
- Current Assignee: KEIHIN CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-210651 20110927; JP2011-210652 20110927
- Main IPC: H02M7/00
- IPC: H02M7/00
Abstract:
A semiconductor device is provided with: a semiconductor element; and a connecting conductor that electrically connects at least one of an input terminal and an output terminal of the semiconductor element to a connection terminal of an electronic device. In this semiconductor device, the connecting conductor is a block structure.
Public/Granted literature
- US20130075886A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-03-28
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