Invention Grant
- Patent Title: Gas enclosure assembly and system
- Patent Title (中): 气体罩组件和系统
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Application No.: US13802304Application Date: 2013-03-13
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Publication No.: US09048344B2Publication Date: 2015-06-02
- Inventor: Justin Mauck , Alexander Sou-Kang Ko , Eliyahu Vronsky , Shandon Alderson
- Applicant: KATEEVA, INC.
- Applicant Address: US CA Menlo Park
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Menlo Park
- Main IPC: B05C11/00
- IPC: B05C11/00 ; C23C14/00 ; H01L33/00 ; H01L21/67 ; F24F3/16

Abstract:
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Public/Granted literature
- US20130206058A1 GAS ENCLOSURE ASSEMBLY AND SYSTEM Public/Granted day:2013-08-15
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