Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14145141Application Date: 2013-12-31
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Publication No.: US09048267B2Publication Date: 2015-06-02
- Inventor: Yoshiyuki Kondo , Masakazu Goto , Shigeru Kawanaka , Toshitaka Miyata
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2013-190889 20130913
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
A semiconductor device according to the present embodiment includes a semiconductor layer. A gate dielectric film is provided on a surface of the semiconductor layer. A gate electrode is provided on the semiconductor layer via the gate dielectric film. A drain layer of a first conductivity type is provided in a part of the semiconductor layer on a side of a first end of the gate electrode. A source layer of a second conductivity type is provided in a part of the semiconductor layer on a side of a second end of the gate electrode and below the gate electrode. The source layer has a substantially uniform impurity concentration at the part of the semiconductor layer below the gate electrode. Voltages of a same polarity are applied to the gate electrode and the drain layer.
Public/Granted literature
- US20150076553A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-03-19
Information query
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