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US09048181B2 Mechanisms for forming ultra shallow junction 有权
形成超浅结的机理

Mechanisms for forming ultra shallow junction
Abstract:
A method of making a semiconductor device includes forming a fin structure over a substrate. The method further includes performing a plasma doping process on the fin structure. Performing the plasma doping process includes implanting plasma ions into the fin structures at a plurality of implant angles, and the plurality of implant angles has an angular distribution and at least one highest angle frequency value.
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