Invention Grant
- Patent Title: Mechanisms for forming ultra shallow junction
- Patent Title (中): 形成超浅结的机理
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Application No.: US14288158Application Date: 2014-05-27
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Publication No.: US09048181B2Publication Date: 2015-06-02
- Inventor: Chii-Ming Wu , Yu Lien Huang , Chun Hsiung Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/265 ; H01L29/66 ; H01L21/8234 ; H01L21/223 ; H01L29/78

Abstract:
A method of making a semiconductor device includes forming a fin structure over a substrate. The method further includes performing a plasma doping process on the fin structure. Performing the plasma doping process includes implanting plasma ions into the fin structures at a plurality of implant angles, and the plurality of implant angles has an angular distribution and at least one highest angle frequency value.
Public/Granted literature
- US20140342537A1 MECHANISMS FOR FORMING ULTRA SHALLOW JUNCTION Public/Granted day:2014-11-20
Information query
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