Invention Grant
US09046793B2 Light transmissive mold and apparatus for imprinting a pattern onto a material applied on a semiconductor workpiece and related methods
有权
用于将图案压印到施加在半导体工件上的材料上的透光模具和设备及相关方法
- Patent Title: Light transmissive mold and apparatus for imprinting a pattern onto a material applied on a semiconductor workpiece and related methods
- Patent Title (中): 用于将图案压印到施加在半导体工件上的材料上的透光模具和设备及相关方法
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Application No.: US13153512Application Date: 2011-06-06
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Publication No.: US09046793B2Publication Date: 2015-06-02
- Inventor: Nobuhito Suehira , Junichi Seki , Masao Majima , Atsunori Terasaki , Hideki Ina
- Applicant: Nobuhito Suehira , Junichi Seki , Masao Majima , Atsunori Terasaki , Hideki Ina
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005-168842 20050608; JP2005-302225 20051017; JP2005-302703 20051018; JP2006-137319 20060517
- Main IPC: B29C59/02
- IPC: B29C59/02 ; G03F9/00 ; B82Y10/00 ; B82Y40/00 ; G03F7/00
Abstract:
A light transmissive mold used for imprinting a pattern onto a material applied on a semiconductor workpiece. The mold includes a first surface having an area of a pattern to be imprinted onto the material, a second surface located opposite from the first surface, and a third surface disposed between the first surface and the second surface, at a position inwardly away from the first surface. The third surface is arranged opposite to an area of the workpiece subjected to dicing. An alignment structure, provided for alignment between the mold and the workpiece, is formed in the third surface.
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