Invention Grant
- Patent Title: Communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses
- Patent Title (中): 通信方法,形成互连的方法,信号互连,集成电路结构,电路和数据装置
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Application No.: US13898356Application Date: 2013-05-20
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Publication No.: US09046649B2Publication Date: 2015-06-02
- Inventor: Chandra Mouli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: G02B6/00
- IPC: G02B6/00 ; G02B6/13 ; G02B6/122 ; G02B6/132 ; G02B6/43 ; G02B6/12

Abstract:
Some embodiments include communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses. In one embodiment, a communication method includes accessing an optical signal comprising photons to communicate information, accessing an electrical signal comprising electrical data carriers to communicate information, and using a single interconnect, communicating the optical and electrical signals between a first spatial location and a second spatial location spaced from the first spatial location.
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