Invention Grant
- Patent Title: Ball screw capable of thermal dissipation based on thermoelectric cooler
- Patent Title (中): 基于热电冷却器的能够散热的滚珠丝杠
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Application No.: US14058744Application Date: 2013-10-21
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Publication No.: US09046165B2Publication Date: 2015-06-02
- Inventor: Yeau-Ren Jeng , Yu-Xian Huang
- Applicant: NATIONAL CHUNG CHENG UNIVERSITY
- Applicant Address: TW Min-Hsiung, Chia-Yi County
- Assignee: National Chung Cheng University
- Current Assignee: National Chung Cheng University
- Current Assignee Address: TW Min-Hsiung, Chia-Yi County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: F16H1/24
- IPC: F16H1/24 ; F16H55/02 ; F16H57/04 ; F16H25/22
Abstract:
A ball screw capable of thermal dissipation is formed of a screw rod, a screw nut, and a plurality of balls mounted between the screw rod and the screw nut. The screw nut includes a mounting surface. A thermoelectric cooler is mounted to the screw nut and includes a heat-absorptive surface and a heat-dissipative surface. The heat-absorptive surface is adhered to the mounting surface. Accordingly, the ball screw can cool the heat down and is structurally simple and the whole weight is not increased due to the thermoelectric cooler.
Public/Granted literature
- US20150107389A1 BALL SCREW CAPABLE OF THERMAL DISSIPATION BASED ON THERMOELECTRIC COOLER Public/Granted day:2015-04-23
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