Invention Grant
- Patent Title: Horizontal interconnects crosstalk optimization
- Patent Title (中): 水平互连串扰优化
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Application No.: US13926830Application Date: 2013-06-25
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Publication No.: US09038011B2Publication Date: 2015-05-19
- Inventor: Shree Krishna Pandey , Changyu Sun
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus generates a plurality of interconnect patterns for a set of longitudinal channels that are occupied by horizontal interconnects. Each interconnect pattern may be different from the other interconnect patterns. Each interconnect pattern may define relative locations for the set of horizontal interconnects and gap channels. Highest crosstalk is determined for each of the interconnect patterns and the interconnect pattern with the minimum highest crosstalk is selected as a preferred pattern. The highest crosstalk may comprise far-end crosstalk or near-end crosstalk and may be calculated for a range of frequencies or for a plurality of frequencies. The crosstalk may be calculated by modeling the interconnects as transmission lines.
Public/Granted literature
- US20140252637A1 HORIZONTAL INTERCONNECTS CROSSTALK OPTIMIZATION Public/Granted day:2014-09-11
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