The present invention relates to circuit boards and, more specifically, circuit boards with vias (i.e. via holes) exhibiting reduced via capacitance. In one embodiment, the present invention provides a circuit board comprising a first electrically conductive trace, a second electrically conductive trace, a via hole including electrically conductive material thereon, and a coupling element that electrically connects the first trace to the second trace. The coupling element comprises a segment of the via hole that bridges the first trace and the second trace, wherein the via hole segment is a remainder of the via hole after removal of a portion of the via hole.