Invention Grant
- Patent Title: Down-flow direct contact cooler
- Patent Title (中): 下流式直接接触式冷却器
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Application No.: US13302248Application Date: 2011-11-22
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Publication No.: US09034081B2Publication Date: 2015-05-19
- Inventor: Dennis W. Johnson
- Applicant: Dennis W. Johnson
- Applicant Address: US CA Aliso Viejo
- Assignee: FLUOR TECHNOLOGIES CORPORATION
- Current Assignee: FLUOR TECHNOLOGIES CORPORATION
- Current Assignee Address: US CA Aliso Viejo
- Agency: Fish & Tsang, LLP
- Main IPC: B01D8/00
- IPC: B01D8/00 ; B01D5/00 ; B01D53/14 ; B01D53/00

Abstract:
Systems and methods are contemplated for down-flow cooling of a feed gas. Contemplated systems can include a housing having an inlet conduit disposed within an upper portion and configured to receive a first stream. First and second stages can be disposed within the housing, with the first stage disposed upstream of the second stage and having a first cooling stream, and the second stage having a second cooling stream that is colder than the first cooling stream. The housing can be configured such that the first stream is cooled by down-flow heat exchange with the first and second cooling streams to produce a conditioned stream depleted of at least a portion of water condensed from the feed gas.
Public/Granted literature
- US20130125752A1 Down-Flow Direct Contact Cooler Public/Granted day:2013-05-23
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