Invention Grant
- Patent Title: Heat dissipation module
- Patent Title (中): 散热模块
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Application No.: US13935315Application Date: 2013-07-03
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Publication No.: US09033028B2Publication Date: 2015-05-19
- Inventor: Che-Ming Wang
- Applicant: Quanta Computer, Inc.
- Applicant Address: TW Taoyuan Shien
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan Shien
- Agency: Sawyer Law Group, P.C.
- Priority: TW102111917A 20130402
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; F28D1/00 ; H01L23/427 ; H01L23/467 ; F28D15/02 ; H01L21/48

Abstract:
A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes an outer housing, a heat dissipation fin array, a retaining wall, an impeller and a rotation-driving device. The outer housing includes an axial air inlet, an axial air outlet and a radial air outlet. The heat dissipation fin array is located at an inner wall of the radial air outlet. The retaining wall is located on a flat wall of the outer housing on which the axial air outlet is located. The retaining wall is in contact with an inner wall of an electronic device to collectively form a circulation channel so as to guide airflows output from the axial air outlet through the flat wall with which the heat dissipation fin array is aligned, and into the axial air inlet. The heat pipe is in contact with the heat dissipation fin array.
Public/Granted literature
- US20140290908A1 HEAT DISSIPATION MODULE Public/Granted day:2014-10-02
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